Redtea Mobile unveiled an integrated eSIM technology based upon its Remote SIM Provisioning (RSP) platform and Qualcomm Snapdragon Mobile Platform featuring iUICC concept at 4G/5G Summit 2017
【HONG KONG, OCTOBER 18, 2017】Redtea Mobile, an eSIM turnkey solution provider, demonstrated its eSIM based application developed on Qualcomm® Snapdragon™ 835 development board featuring integrated UICC (iUICC) concept and the deployment of its eSIM capability on Qualcomm Snapdragon Mobile Platforms at the Qualcomm Technologies’ 4G/5G Summit in Hong Kong during October 16-18. Qualcomm Technologies, Inc. is a subsidiary of Qualcomm Incorporated.
Integrating Redtea Mobile’s embedded SIM (eSIM) software component into Qualcomm Technologies’ iUICC concept featuring in Snapdragon Mobile Platforms, the combination is designed to address the growing demands for a higher level of connectivity on mobile devices — to address the security platforms in the device and be the trusted element for SIM.
As one of the eSIM implementations, the iUICC module has no separate off-chip component as the SoC solution combines the secure processor, the baseband processor and possibly other processors into one discrete hardware component. This solution can satisfy prevailing and future security requirements.
In particular, Redtea Mobile will deploy their eSIM terminal solution (e.g. LPA) and Subscription Manager-Data Preparation+ (SM-DP+) cloud service on top of Qualcomm Technologies’ iUICC. This eSIM offering for consumer electronics is compliant with GSMA eSIM standards to support fast, seamless deployment and connectivity for OEMs and mobile network operators (MNOs).
“An important aspect of our 5G vision is the adoption of leading new standards and innovations around the trusted SIM card,” said Sy Choudhury, senior director of product management, Qualcomm Technologies, Inc. “Qualcomm Technologies and Redtea Mobile have worked together to demonstrate how the GSMA’s Remote SIM Provisioning specification for embedded SIM can run on a Snapdragon Mobile Platform while effectively integrating with existing mobile operator infrastructures.”
“We’re excited to showcase our eSIM Technology running on the Snapdragon Mobile Platform to the world’s most innovative device manufacturers and mobile operators at Qualcomm Technologies’ annual 4G/5G Summit in Hong Kong,” said Dr. Hui Jin, CEO and Co-founder of Redtea Mobile. “As an established brand that has shipped its eSIM capability and data/roaming service to over 100 million devices by partnering with 20+ MNOs/MVNOs worldwide and a majority of smartphone manufacturers including OPPO, vivo, Samsung (China), Xiaomi, Lenovo, ZTE, Meizu, LeEco, and Smartisans, Redtea’s proven technology brings a brand new level of features and convenience to consumers and the roaming industry as a whole. The demonstration with Qualcomm Technologies is a first of its kind to show integrated eSIM capabilities on a Qualcomm Technologies platform and may offer a generational leap in data connectivity.”
“We are always pursuing a more complete and integrated solution for device manufacturers. By working together, Redtea Mobile and Qualcomm Technologies are demonstrating how a leading and innovative eSIM and SoC can be integrated at the platform level, while also making the solution easier to integrate for device manufacturers, to reduce physical space requirements and be more cost effective,” said Ming Jiang, Redtea Mobile’s CTO and Co-founder.
VP of Brand Management, Redtea Mobile
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